Semiconductor package structure

ABSTRACT

A semiconductor package structure includes a frontside redistribution layer, a stacking structure, a backside redistribution layer, a first intellectual property (IP) core, and a second IP core. The stacking structure is disposed over the frontside redistribution layer and comprises a first semiconductor die and a second semiconductor die over the first semiconductor die. The backside redistribution layer is disposed over the stacking structure. The first IP core is disposed in the stacking structure and is electrically coupled to the frontside redistribution layer through a first routing channel. The second IP core is disposed in the stacking structure and is electrically coupled to the backside redistribution layer through a second routing channel, wherein the second routing channel is separated from the first routing channel and electrically insulated from the frontside redistribution layer.

CROSS REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of U.S. Provisional Application No.63/048,734 filed on Jul. 7, 2020, the entirety of which is incorporatedby reference herein.

BACKGROUND OF THE INVENTION Field of the Invention

The present invention is related to semiconductor packaging technology,and in particular to a semiconductor package structure.

Description of the Related Art

With the increasing demand for more functions and smaller devices,package-on-package (PoP) technology, which vertically stacks two or morepackages, has become increasingly popular. The PoP technology minimizestrack lengths between different components, such as a controller and amemory device. This provides better electrical performance, sinceshorter routing of interconnections yields faster signal propagation andreduced noise and cross-talk defects.

Although existing semiconductor package structures are generallyadequate, they are not satisfactory in every respect. For example, it ischallenging to fulfill the channel requirements for integratingdifferent components in a package. Therefore, there is a need to furtherimprove semiconductor package structures to provide flexibility inchannel design.

BRIEF SUMMARY OF THE INVENTION

In accordance with some embodiments, a semiconductor package structureis provided. The semiconductor package structure includes a frontsideredistribution layer, a stacking structure, a backside redistributionlayer, a first intellectual property (IP) core, and a second IP core.The stacking structure is disposed over the frontside redistributionlayer and comprises a first semiconductor die and a second semiconductordie over the first semiconductor die. The backside redistribution layeris disposed over the stacking structure. The first IP core is disposedin the stacking structure and is electrically coupled to the frontsideredistribution layer through a first routing channel. The second IP coreis disposed in the stacking structure and is electrically coupled to thebackside redistribution layer through a second routing channel, whereinthe second routing channel is separated from the first routing channeland electrically insulated from the frontside redistribution layer.

In accordance with some embodiments, a semiconductor routing structureis provided. The semiconductor routing structure includes a firstpackage structure, a first routing channel, and a second routingchannel. The first package structure has a frontside and a backside andcomprises a stacking structure which has a first intellectual property(IP) core and a second IP core. The first routing channel electricallycouples the first IP core to a first redistribution layer on thefrontside of the first package structure. The second routing channelindependently and electrically couples the second IP core to a secondredistribution layer on the backside of the first package structure,wherein the second routing channel is separated from the first routingchannel and electrically insulated from the first redistribution layer.

A detailed description is given in the following embodiments withreference to the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention can be more fully understood by reading thesubsequent detailed description and examples with references made to theaccompanying drawings, wherein:

FIG. 1 is a cross-sectional view of an exemplary semiconductor packagestructure in accordance with some embodiments;

FIGS. 2A-2D are cross-sectional views of stacking structures inexemplary semiconductor package structures in accordance with someembodiments;

FIG. 3 is a cross-sectional view of an exemplary semiconductor packagestructure in accordance with some embodiments;

FIG. 4 is a cross-sectional view of an exemplary semiconductor packagestructure in accordance with some embodiments;

FIG. 5 is a cross-sectional view of an exemplary semiconductor packagestructure in accordance with some embodiments;

FIG. 6 is a cross-sectional view of an exemplary semiconductor packagestructure in accordance with some embodiments; and

FIG. 7 is a cross-sectional view of an exemplary semiconductor packagestructure in accordance with some embodiments.

DETAILED DESCRIPTION OF THE INVENTION

The following description is of the best-contemplated mode of carryingout the invention. This description is made for the purpose ofillustrating the general principles of the invention and should not betaken in a limiting sense. The scope of the invention is determined byreference to the appended claims.

The present invention will be described with respect to particularembodiments and with reference to certain drawings, but the invention isnot limited thereto and is only limited by the claims. The drawingsdescribed are only schematic and are non-limiting. In the drawings, thesize of some of the elements may be exaggerated for illustrativepurposes and not drawn to scale. The dimensions and the relativedimensions do not correspond to actual dimensions in the practice of theinvention.

A semiconductor package structure and a semiconductor routing structureare described in accordance with some embodiments of the presentdisclosure. The semiconductor package structure provides an individualrouting channel for a device and an IP core, such as a memory device anda memory IP core, so that the flexibility of routing channel design canbe elevated.

FIG. 1 is a cross-sectional view of a semiconductor package structure100 in accordance with some embodiments of the disclosure. Additionalfeatures can be added to the semiconductor package structure 100. Someof the features described below can be replaced or eliminated fordifferent embodiments. To simplify the diagram, only a portion of thesemiconductor package structure 100 is illustrated.

As shown in FIG. 1, the semiconductor package structure 100 includes afirst package structure 100 a and a second package structure 100 bstacked vertically, in accordance with some embodiments. The firstpackage structure 100 a has a frontside and a backside opposite to thefrontside. The first package structure 100 a may have a firstredistribution layer 102 on the frontside and a second redistributionlayer 124 on the backside. Therefore, the first redistribution layer 102may be also referred to as the frontside redistribution layer 102, andthe second redistribution layer 124 may be also referred to as thebackside redistribution layer 124.

The first redistribution layer 102 may include one or more conductivelayers and passivation layers, wherein the one or more conductive layersmay be disposed in the one or more passivation layers. The conductivelayers may include metal, such as copper, titanium, tungsten, aluminum,the like, or a combination thereof. In some embodiments, the passivationlayers include a polymer layer, for example, polyimide (PI),polybenzoxazole (PBO), benzocyclobutene (BCB), epoxy, the like, or acombination thereof. Alternatively, the passivation layers may include adielectric layer, such as silicon oxide, silicon nitride, siliconoxynitride, the like, or a combination thereof. The material of thesecond redistribution layer 124 may be similar to the material of thefirst redistribution layer 102, and will not be repeated.

As shown in FIG. 1, the first redistribution layer 102 includes moreconductive layers and passivation layers than the second redistributionlayer 124 in accordance with some embodiments. The first redistributionlayer 102 may be thicker than the second redistribution layer 124, butthe present disclosure is not limit thereto. For example, the secondredistribution layer 124 may be thicker than or substantially equal tothe first redistribution layer 102.

In some embodiments, the first package structure 100 a includes aplurality of conductive structures 104 below the first redistributionlayer 102 and electrically coupled to the first redistribution layer102. In some embodiments, the conductive structures 104 includeconductive materials, such as metal. The conductive structures 104 mayinclude microbumps, controlled collapse chip connection (C4) bumps, ballgrid array (BGA) balls, the like, or a combination thereof.

In some embodiments, the first package structure 100 a includes astacking structure which includes a first semiconductor die 106 and asecond semiconductor die 112 stacked vertically over the firstredistribution layer 102. According to some embodiments, the firstsemiconductor die 106 and the second semiconductor die 112 eachindependently includes a system-on-chip (SoC) die, a logic device, amemory device, a radio frequency (RF) device, the like, or anycombination thereof. For example, the first semiconductor die 106 andthe second semiconductor die 112 may each independently include a microcontrol unit (MCU) die, a microprocessor unit (MPU) die, a powermanagement integrated circuit (PMIC) die, a global positioning system(GPS) device, a central processing unit (CPU) die, a graphics processingunit (GPU) die, an input-output (TO) die, a dynamic random access memory(DRAM) IP core, a static random-access memory (SRAM), a high bandwidthmemory (HBM), the like, or any combination thereof.

Although two semiconductor dies, the first semiconductor die 106 and thesecond semiconductor die 112, are shown in FIG. 1, there may be morethan two semiconductor dies. For example, the stacking structure mayinclude three semiconductor dies stacked vertically. Alternatively, thestacking structure may include four semiconductor dies, wherein two ofthem are stacked vertically over a semiconductor die, and the othersemiconductor die is disposed over the semiconductor die and adjacent tothe two semiconductor dies. In some embodiments, the stacking structurealso includes one or more passive components (not illustrated), such asresistors, capacitors, inductors, the like, or a combination thereof.

As shown in FIG. 1, the first semiconductor die 106 includes a pluralityof through vias 108, which are electrically coupled to the firstredistribution layer 102. The through vias 108 may be formed ofconductive material, such as a metal. For example, the through vias 108may be formed of copper. As shown in FIG. 1, the through vias 108 havesubstantially vertical sidewalls and extend from the top surface of thefirst semiconductor die 106 to the bottom surface of the firstsemiconductor die 106, but the present disclosure is not limit thereto.The through vias 108 in the first semiconductor die 106 may have otherconfigurations and numbers.

In some embodiments, the first package structure 100 a includes a thirdredistribution layer 110 between the first redistribution layer 102 andthe second redistribution layer 124. As shown in FIG. 1, the thirdredistribution layer 110 may be disposed between the top surface of thefirst semiconductor die 106 and the bottom surface of the secondsemiconductor die 112, and may extend beyond the sidewalls of the firstsemiconductor die 106 and the sidewalls of the second semiconductor die112. The third redistribution layer 110 may be electrically coupled tothe first semiconductor die 106, the through vias 108 in the firstsemiconductor die 106, and the second semiconductor die 112.

The material of the third redistribution layer 110 may be similar to thematerial of the first redistribution layer 102, and will not berepeated. As shown in FIG. 1, the first redistribution layer 102includes more conductive layers and passivation layers than the thirdredistribution layer 110, and the third redistribution layer 110includes more conductive layers and passivation layers than the secondredistribution layer 124, but the present disclosure is not limitthereto. For example, the second redistribution layer 124 may includemore conductive layers and passivation layers than the firstredistribution layer 102 and the third redistribution layer 110.

By disposing the third redistribution layer 110, an additional routingchannel can be formed between the first semiconductor die 106 and thesecond semiconductor die 112, which is help for floorplan flexibilityand save die bump fanout width, as described below and shown in FIGS.2A-2D.

FIG. 2A is a cross-sectional view of a stacking structure 200 a in thesemiconductor package structure 100 in accordance with some embodiments.To simplify the diagram, only a portion of the stacking structure 200 ais illustrated. In some embodiments, the stacking structure 200 aincludes the first semiconductor die 106 and the second semiconductordie 112.

The first semiconductor die 106 has an active surface 106 a and abackside surface 106 b opposite to the active surface 106 a. The secondsemiconductor die 112 has an active surface 112 a and a backside surface112 b opposite to the active surface 112 a. The first semiconductor die106 and the second semiconductor die 112 may be stacked face to face(FtF). That is, the active surface 112 a of the second semiconductor die112 is close to the active surface 106 a of the first semiconductor die106.

As shown in FIG. 2A, a first intellectual property (IP) core 101 and asecond IP core 103 may be disposed on the active surface 106 a of thefirst semiconductor die 106. In some embodiments, the first IP core 101is used for control the second package structure 100 b (as shown in FIG.1), and the second IP core 103 is used for control the other componentwhich is electrically coupled to the first redistribution layer 102.

According to some embodiments, since the third redistribution layer 110is disposed between the first semiconductor die 106 and the secondsemiconductor die 112, an additional routing channel can be formedtherebetween. As a result, the signal from the first IP core 101 and thesignal from the second IP core 103 can pass through different routingchannels, for example, as indicated by the path 101P and the path 103P,respectively. In particular, the routing channel of the first IP core101 (indicated by the path 101P) may pass the third redistribution layer110 (as shown in FIG. 1), and the routing channel of the second IP core103 (indicated by the path 103P) may pass the through vias 108 in thefirst semiconductor die 106 and the first redistribution layer 102 (asshown in FIG. 1).

That is, in comparison with both of the routing channel for the first IPcore 101 and the routing channel for the second IP core 103 pass throughthe first redistribution layer 102, individual routing channels for thefirst IP core 101 and the second IP core 103 can be provided in thepresent disclosure. In this way, these routing channels can be optimizedseparately to fulfill the different channel requirements. In addition,the routing channel for the first IP core 101 would not affect therouting channel for the second IP core 103, and thus the channel designflexibility can be increased.

As shown in FIG. 2A, the first IP core 101 and the second IP core 103are separate and disposed side by side, but the present disclosure isnot limit thereto. For example, the first IP core 101 may be placed inthe second IP core 103 according to some other embodiments.Alternatively, the first IP core 101 and the second IP core 103 may bedisposed adjacent to different edges of the first semiconductor die 102.In addition, there may be more than two IP cores.

FIG. 2B is a cross-sectional view of a stacking structure 200 b in thesemiconductor package structure 100 in accordance with some embodiments.To simplify the diagram, only a portion of the stacking structure 200 bis illustrated. The stacking structure 200 b may include the same orsimilar components as that of the stacking structure 200 a shown in FIG.2A, and for the sake of simplicity, those components will not bediscussed in detail again. In the following embodiments, the first IPcore 101 is disposed on the active surface 112 a of the secondsemiconductor die 112, and the second IP core 103 is disposed on theactive surface 106 a of the first semiconductor die 106.

As shown in FIG. 2B, the signal from the first IP core 101 and thesignal from the second IP core 103 can pass through different routingchannels, for example, as indicated by the path 101P and the path 103P,respectively. In particular, the routing channel of the first IP core101 (indicated by the path 101P) may pass the third redistribution layer110 (as shown in FIG. 1), and the routing channel of the second IP core103 (indicated by the path 103P) may pass the through vias 108 in thefirst semiconductor die 106 and the first redistribution layer 102 (asshown in FIG. 1).

FIG. 2C is a cross-sectional view of a stacking structure 200 c in thesemiconductor package structure 100 in accordance with some embodiments.To simplify the diagram, only a portion of the stacking structure 200 cis illustrated. The stacking structure 200 c may include the same orsimilar components as that of the stacking structure 200 a shown in FIG.2A, and for the sake of simplicity, those components will not bediscussed in detail again. In the following embodiments, the firstsemiconductor die 106 and the second semiconductor die 112 may bestacked face to back (FtB). That is, the active surface 112 a of thesecond semiconductor die 112 is close to the backside surface 106 b ofthe first semiconductor die 106.

As shown in FIG. 2C, the first IP core 101 and the second IP core 103are disposed on the active surface 106 a of the first semiconductor die106. The signal from the first IP core 101 and the signal from thesecond IP core 103 can pass through different routing channels, forexample, as indicated by the path 101P and the path 103P, respectively.In particular, the routing channel of the first IP core 101 (indicatedby the path 101P) may pass the through vias 108 in the firstsemiconductor die 106 and the third redistribution layer 110 (as shownin FIG. 1), and the routing channel of the second IP core 103 (indicatedby the path 103P) may pass the first redistribution layer 102 (as shownin FIG. 1).

FIG. 2D is a cross-sectional view of a stacking structure 200 d in thesemiconductor package structure 100 in accordance with some embodiments.To simplify the diagram, only a portion of the stacking structure 200 dis illustrated. The stacking structure 200 d may include the same orsimilar components as that of the stacking structure 200 a shown in FIG.2A, and for the sake of simplicity, those components will not bediscussed in detail again. In the following embodiments, the first IPcore 101 is disposed on the active surface 112 a of the secondsemiconductor die 112, and the second IP core 103 is disposed on theactive surface 106 a of the first semiconductor die 106.

As shown in FIG. 2D, the signal from the first IP core 101 and thesignal from the second IP core 103 can pass through different routingchannels, for example, as indicated by the path 101P and the path 103P,respectively. In particular, the routing channel of the first IP core101 (indicated by the path 101P) may pass the third redistribution layer110 (as shown in FIG. 1), and the routing channel of the second IP core103 (indicated by the path 103P) may pass through the firstredistribution layer 102 (as shown in FIG. 1).

Referring back to FIG. 1, a plurality of conductive structures 114 areformed between the third redistribution layer 110 and the secondsemiconductor die 112, according to some embodiments. The conductivestructures 114 may electrically couples the second semiconductor die 112to the third redistribution layer 110. Depending on the routing channeldesign and the positions of the IP cores, the routing channel may alsoinclude the conductive structures 114.

In some embodiments, the conductive structures 114 include conductivematerials, such as metal. The conductive structures 114 may includemicrobumps, controlled collapse chip connection (C4) bumps, ball gridarray (BGA) balls, the like, or a combination thereof.

In some embodiments, an underfill material 116 is formed between thesecond semiconductor die 112 and the third redistribution layer 110, andfills in gaps between the conductive structures 114 to providestructural support. The underfill material 116 may surround each of theconductive structures 114. In some embodiments, the underfill material116 is formed of polymer, such as epoxy. The underfill material 116 maybe dispensed with capillary force after the conductive structures 114are formed between the second semiconductor die 112 and the thirdredistribution layer 110. Then, the underfill material 116 may be curedthrough any suitable curing process.

As shown in FIG. 1, the first package structure 100 a includes a moldingmaterial 118 surrounding the second semiconductor die 112 and theunderfill material 116, and covering a portion of the top surface of thethird redistribution layer 110. In some embodiments, the moldingmaterial 118 adjoins the sidewalls of the second semiconductor die 112and the top surface of the third redistribution layer 110. The moldingmaterial 118 may protect the second semiconductor die 112 from theenvironment, thereby preventing the second semiconductor die 112 fromdamage due to, for example, the stress, the chemicals and/or themoisture.

The molding material 118 may include a nonconductive material, such as amoldable polymer, an epoxy, a resin, the like, or a combination thereof.In some embodiments, the molding material 118 is applied in liquid orsemi-liquid form, and then is cured through any suitable curing process,such as a thermal curing process, a UV curing process, the like, or acombination thereof. The molding material 118 may be shaped or moldedwith a mold (not shown).

Then, the molding material 118 may be partially removed by aplanarization process, such as chemical mechanical polishing (CMP),until the top surface of the second semiconductor die 112 is exposed. Insome embodiments, the top surface of the molding material 118 and thetop surface of the second semiconductor die 112 are substantiallycoplanar. As shown in FIG. 1, the sidewalls of the molding material 118may be coplanar with the sidewalls of the first semiconductor die 106.

In some embodiments, a plurality of conductive pillars 120 are formedadjacent to the stacking structure (including the first semiconductordie 106 and the second semiconductor die 112) and the molding material118. The conductive pillars 120 may include metal pillars, such ascopper pillars. In some embodiments, the conductive pillars 120 areformed by a plating process or any other suitable process. As shown inFIG. 1, the conductive pillars 120 may have substantially verticalsidewalls.

As shown in FIG. 1, the conductive pillars 120 may be disposed betweenthe first redistribution layer 102 and the second redistribution layer124, and may be disposed on the top surface and the bottom surface ofthe third redistribution layer 110. The conductive pillars 120 may beelectrically coupled to the first redistribution layer 102, the secondredistribution layer 124, and the third redistribution layer 110.

The positions and the numbers of the conductive pillars 120 may beadjusted according to the routing design of the first package structure100 a. For example, in some other embodiments, the conductive pillars120 are disposed between the second redistribution layer 124 and thethird redistribution layer 110, and are not disposed between the firstredistribution layer 102 and the third redistribution layer 110. Inthese embodiments, the second redistribution layer 124 is electricallycoupled to the third redistribution layer 110 through the conductivepillars 120, and the third redistribution layer 110 is electricallycoupled to the first redistribution layer 102 through the through vias108 in the first semiconductor die 106.

As shown in FIG. 1, four conductive pillars 120 are disposed on oppositesides of the stacking structure, but the present disclosure is not limitthereto. For example, the number of conductive pillars 120 may bedifferent on opposite sides of the stacking structure. Alternatively,the conductive pillars 120 may be disposed on one side of the stackingstructure.

As shown in FIG. 1, the first package structure 100 a includes a moldingmaterial 122 surrounding the stacking structure (including the firstsemiconductor die 106 and the second semiconductor die 112), the moldingmaterial 118, and the conductive pillars 120. The molding material 122may fill in gaps between the conductive pillars 120, and between thestacking structure and the conductive pillars 120.

As shown in FIG. 3, the molding material 122 adjoins the sidewalls ofthe first semiconductor die 106 and the molding material 118, and coversthe top surface of the first redistribution layer 102, the bottomsurface of the second redistribution layer 124, the top surface and thebottom surface of the third redistribution layer 110. The moldingmaterial 122 may protect the stacking structure and the conductivepillars 120 from the environment, thereby preventing the stackingstructure and the conductive pillars 120 from damage due to, forexample, the stress, the chemicals and/or the moisture.

In some embodiments, the molding material 122 includes a nonconductivematerial, such as a moldable polymer, an epoxy, a resin, the like, or acombination thereof. In some embodiments, the molding material 122 isapplied in liquid or semi-liquid form, and then is cured through anysuitable curing process, such as a thermal curing process, a UV curingprocess, the like, or a combination thereof. The molding material 122may be shaped or molded with a mold (not shown).

Then, the molding material 122 may be partially removed by aplanarization process, such as chemical mechanical polishing (CMP),until the top surfaces of the conductive pillars 120 are exposed. Insome embodiments, top surfaces of the molding material 122 and theconductive pillars 120 are substantially coplanar. As shown in FIG. 1,the sidewalls of the molding material 122 may be coplanar with at leastone of the sidewalls of the first redistribution layer 102, the secondredistribution layer 124, and the third redistribution layer 110.

As shown in FIG. 1, the second redistribution layer 124 may be disposedover the stacking structure, and may cover the top surface of the secondsemiconductor die 112, the top surface of the conductive pillars 120,and the top surface of the molding material 122.

As shown in FIG. 1, the second package structure 100 b is disposed overthe first package structure 100 a and is electrically coupled to thesecond redistribution layer 124 through a plurality of conductivestructures 126, in accordance with some embodiments. In someembodiments, the conductive structures 126 include conductive materials,such as metal. The conductive structures 126 may include microbumps,controlled collapse chip connection (C4) bumps, ball grid array (BGA)balls, the like, or a combination thereof.

As shown in FIG. 1, the second package structure 100 b includes asubstrate 128, in accordance with some embodiments. The substrate 128may have a wiring structure therein. In some embodiments, the wiringstructure of the substrate 128 includes conductive layers, conductivevias, conductive pillars, the like, or a combination thereof. The wiringstructure of the substrate 128 may be formed of metal, such as copper,titanium, tungsten, aluminum, the like, or a combination thereof.

The wiring structure of the substrate 128 may be disposed in inter-metaldielectric (IMD) layers. In some embodiments, the IMD layers may beformed of organic materials, such as a polymer base material, anon-organic material, such as silicon nitride, silicon oxide, siliconoxynitride, the like, or a combination thereof. Any desiredsemiconductor element may be formed in and on the substrate 128.However, in order to simplify the diagram, only the flat substrate 128is illustrated.

As shown in FIG. 1, the second package structure 100 b includessemiconductor components 130 and 132 over substrate 128, in accordancewith some embodiments. The semiconductor components 130 and 132 mayinclude memory dies, such as a dynamic random access memory (DRAM). Thesemiconductor components 130 and 132 may be double data rate (DDR)synchronous dynamic random access memory (SDRAM) dies for use in amobile system, for example. In the embodiments where the second packagestructure 100 b includes a memory device, the IP core for the secondpackage structure 100 b (such as the first IP core 101) may be referredto as the memory IP core.

The semiconductor components 130 and 132 may include the same ordifferent devices. In some embodiments, the second package structure 100b also includes one or more passive components (not illustrated), suchas resistors, capacitors, inductors, the like, or a combination thereof.

The first IP core 101 (as shown in FIGS. 2A-2D) in the stackingstructure may be electrically coupled to the second package structure100 b through a first routing channel which includes the thirdredistribution layer 110, the conductive pillars 120, and the secondredistribution layer 124. The second IP core 103 (as shown in FIGS.2A-2D) in the stacking structure may be electrically coupled to theconductive structure 104 through a second routing channel which includesthe first redistribution layer 110. In some embodiments, depending onthe position of the IP cores, as described above, the first routingchannel or the second routing channel may further include the throughvias 108 in the first semiconductor die 106 and/or the conductivestructures 114.

In other words, the routing channel between the IP core and the secondpackage structure 100 b may be separated from the other routingchannels, such as the routing channel between another IP core and theconductive structure 104. In particular, the routing channel between theIP core and the second package structure 100 b is electrically insulatedfrom the first redistribution layer 110 according to some embodiments.As a result, different routing channels can be optimized separately, andthe channel design flexibility can be increased.

FIG. 3 is a cross-sectional view of a semiconductor package structure300 in accordance with some embodiments of the disclosure. It should benoted that the semiconductor package structure 300 may include the sameor similar components as that of the semiconductor package structure 100shown in FIG. 1, and for the sake of simplicity, those components willnot be discussed in detail again. In the following embodiments, therouting channel includes a conductive pillar 134 over the firstsemiconductor die 106 and adjacent to the second semiconductor die 112.

The conductive pillar 134 is electrically coupled to the secondredistribution layer 124, the first semiconductor die 106, and thethrough vias 108 in the first semiconductor die 106, according to someembodiments. In the embodiments where the IP core for the second packagestructure 100 b is formed on the bottom of the first semiconductor die106, the routing channel between the IP core and the second packagestructure 100 b may include the through vias 108 in the firstsemiconductor die 106, the conductive pillar 134, and the secondredistribution layer 124. In the embodiments where the IP core for thesecond package structure 100 b is formed on the top of the firstsemiconductor die 106, the routing channel between the IP core and thesecond package structure 100 b may include the conductive pillar 134 andthe second redistribution layer 124.

The conductive pillar 134 may include a metal pillar, such as a copperpillar. In some embodiments, the conductive pillar 134 is formed by aplating process or any other suitable process. The conductive pillar 134may have substantially vertical sidewalls. As shown in FIG. 3, theconductive pillar 134 may be surrounded by the molding material 118. Theconductive pillar 134 may have substantially vertical sidewalls and mayextend from the bottom surface of the molding material 118 to the topsurface of the molding material 118.

The positions and the numbers of the conductive pillar 134 may beadjusted according to the routing design of the first package structure100 a. For example, more than one conductive pillar 134 may be disposedover the first semiconductor die 106, and may be disposed adjacent toone side or opposite sides of the semiconductor die 112. In addition,the semiconductor package structure 300 may further include one or moreredistribution layers, such as the third redistribution layer 110 inFIG. 1.

FIG. 4 is a cross-sectional view of a semiconductor package structure400 in accordance with some embodiments of the disclosure. It should benoted that the semiconductor package structure 400 may include the sameor similar components as that of the semiconductor package structure 100shown in FIG. 1, and for the sake of simplicity, those components willnot be discussed in detail again. In the following embodiments, therouting channel includes a through via 136 in the second semiconductordie 112.

The through via 136 may be electrically coupled to the secondredistribution layer 124, the conductive structures 114, the firstsemiconductor die 106, and the through vias 108 in the firstsemiconductor die 106. In the embodiments where the IP core for thesecond package structure 100 b is formed on the bottom of the firstsemiconductor die 106, the routing channel between the IP core and thesecond package structure 100 b may include the through vias 108 in thefirst semiconductor die 106, the conductive structures 114, the throughvia 136, and the second redistribution layer 124. In the embodimentswhere the IP core for the second package structure 100 b is formed onthe top of the first semiconductor die 106, the routing channel betweenthe IP core and the second package structure 100 b may include theconductive structures 114, the through via 136, and the secondredistribution layer 124.

In the embodiments where the IP core for the second package structure100 b is formed on the bottom of the second semiconductor die 112, therouting channel between the IP core and the second package structure 100b may include the through via 136 and the second redistribution layer124. In the embodiments where the IP core for the second packagestructure 100 b is formed on the top of the second semiconductor die112, the routing channel between the IP core and the second packagestructure 100 b may include the second redistribution layer 124, and thethrough via 136 may be omitted.

In these embodiments, the routing channel between the secondredistribution layer 124 and the IP core does not extend outside thefirst semiconductor die 106 and the second semiconductor die 112. Inparticular, the routing channel between the second redistribution layer124 and the IP core passes the region shielded by the firstsemiconductor die 106 and/or the second semiconductor die 112.

The through via 136 may be formed of any conductive material, such as ametal. For example, the through via 136 is formed of copper. As shown inFIG. 4, the through via 136 may have substantially vertical sidewallsand may extend from the top surface of the second semiconductor die 112to the bottom surface of the second semiconductor die 112, but thepresent disclosure is not limit thereto. The through via 136 in thesecond semiconductor die 112 may have other configurations.

The positions and the numbers of the through via 136 may be adjustedaccording to the routing design of the first package structure 100 a.For example, more than one through via 136 may be disposed in the secondsemiconductor die 112. Alternatively, the semiconductor packagestructure 400 may further include one or more redistribution layers(such as the third redistribution layer 110 in FIG. 1) and/or one ormore conductive pillars (such as the conductive pillar 134 in FIG. 3).

FIG. 5 is a cross-sectional view of a semiconductor package structure500 in accordance with some embodiments of the disclosure. It should benoted that the semiconductor package structure 500 may include the sameor similar components as that of the semiconductor package structure 100shown in FIG. 1, and for the sake of simplicity, those components willnot be discussed in detail again. In the following embodiments, thelarger first semiconductor die 106 is disposed over the smaller secondsemiconductor die 112.

As shown in FIG. 5, the second semiconductor die 112 may include aplurality of through vias 138, which may be electrically coupled to thefirst redistribution layer 102, the conductive structures 114, and thethrough vias 108 in the first semiconductor die 106. The through vias138 may be formed of any conductive material, such as a metal. Forexample, the through vias 138 may be formed of copper. As shown in FIG.1, the through vias 138 may each have substantially vertical sidewallsand may extend from the top surface of the second semiconductor die 112to the bottom surface of the second semiconductor die 112. However, thethrough vias 138 in the second semiconductor die 112 may have otherconfigurations and numbers.

The through vias 138 may be electrically coupled to the firstredistribution layer 102, the conductive structures 114, the firstsemiconductor die 106, and the through vias 108 in the firstsemiconductor die 106. In the embodiments where the IP core for thesecond package structure 100 b is formed on the bottom of the secondsemiconductor die 112, the routing channel between the IP core and thesecond package structure 100 b may include the through vias 138 in thesecond semiconductor die 112, the conductive structures 114, the throughvias 108 in the first semiconductor die 106, and the secondredistribution layer 124. In the embodiments where the IP core for thesecond package structure 100 b is formed on the top of the secondsemiconductor die 112, the routing channel between the IP core and thesecond package structure 100 b may include the conductive structures114, the through vias 108 in the first semiconductor die 106, and thesecond redistribution layer 124.

In the embodiments where the IP core for the second package structure100 b is formed on the bottom of the first semiconductor die 106, therouting channel between the IP core and the second package structure 100b may include the through vias 108 in the first semiconductor die 106and the second redistribution layer 124. In the embodiments where the IPcore for the second package structure 100 b is formed on the top of thefirst semiconductor die 106, the routing channel between the IP core andthe second package structure 100 b may include the second redistributionlayer 124, and the through vias 108 may be omitted.

In these embodiments, the routing channel between the secondredistribution layer 124 and the IP core does not extend outside thefirst semiconductor die 106 and the second semiconductor die 112. Inparticular, the routing channel between the second redistribution layer124 and the IP core passes the region shielded by the firstsemiconductor die 106 and/or the second semiconductor die 112.

As shown in FIG. 5, the first package structure 100 a may include one ormore conductive pillars 140 below the first semiconductor die 106 andadjacent to the second semiconductor die 112. The conductive pillars 140are optional. The conductive pillars 140 may include metal pillars, suchas copper pillars. In some embodiments, the conductive pillars 140 areformed by a plating process or any other suitable process.

The conductive pillars 140 may be electrically coupled to the firstredistribution layer 102, the first semiconductor die 106, and thethrough vias 108 of the first semiconductor die 106. As shown in FIG. 5,each of the conductive pillars 140 may have substantially verticalsidewalls. The conductive pillars 140 may be surrounded by the moldingmaterial 108 and extend from the top surface of the molding material 108to the bottom surface of the molding material 108.

The positions and the numbers of the conductive pillars 140 may beadjusted according to the routing design of the first package structure100 a. As shown in FIG. 5, two conductive pillars 140 are disposedadjacent to opposite sides of the second semiconductor die 112, but thepresent disclosure is not limit thereto. For example, the number ofconductive pillars 140 may be different on opposite sides of thestacking structure. Alternatively, the conductive pillars 140 may bedisposed on one side of the stacking structure.

FIG. 6 is a cross-sectional view of a semiconductor package structure600 in accordance with some embodiments of the disclosure. It should benoted that the semiconductor package structure 600 may include the sameor similar components as that of the semiconductor package structure 100shown in FIG. 1, and for the sake of simplicity, those components willnot be discussed in detail again. In the following embodiments, thestacking structure includes a plurality of semiconductor components 142,144, 146 over the first semiconductor die 106 and adjacent to the secondsemiconductor die 112.

The semiconductor components 142, 144, 146 may include activecomponents. For example, the semiconductor components 142, 144, 146 mayeach independently include a system-on-chip (SoC) die, a logic device, amemory device, a radio frequency (RF) device, the like, or anycombination thereof. For example, the semiconductor components 142, 144,146 may each independently include a micro control unit (MCU) die, amicro processor unit (MPU) die, a power management integrated circuit(PMIC) die, a global positioning system (GPS) device, a centralprocessing unit (CPU) die, a graphics processing unit (GPU) die, aninput-output (IO) die, a dynamic random access memory (DRAM) IP core, astatic random-access memory (SRAM), a high bandwidth memory (HBM), thelike, or any combination thereof.

In some other embodiments, the semiconductor components 142, 144, 146include passive components, such as resistors, capacitors, inductors,the like, or a combination thereof. The semiconductor components 142,144, 146 may include the same or different devices.

The semiconductor components 142, 144, 146 may be electrically coupledto the first semiconductor die 106. Each of the semiconductor components142, 144, 146 may be surrounded and covered by the molding material 108.It should be noted that the number and the positions of thesemiconductor components 142, 144, 146, the first semiconductor die 106,and the second semiconductor die 112 are illustrative only, and thepresent disclosure is not limit thereto.

For example, the semiconductor components 142, 144, 146 may be stackedvertically. Alternatively, the stacking structure may include twosemiconductor components which are stacked vertically. In some otherembodiments, the stacking structure may include four semiconductorcomponents, wherein two of them are stacked vertically over asemiconductor component, and the other semiconductor component isdisposed over the semiconductor component and adjacent to the twosemiconductor components.

Depending on the routing design of the first package structure 100 a,the semiconductor package structure 600 may further include one or moreredistribution layers (such as the third redistribution layer 110 inFIG. 1), one or more conductive pillars (such as the conductive pillar134 in FIG. 3), and/or one or more through vias in semiconductor dies(such as the through via 136 in FIG. 4).

FIG. 7 is a cross-sectional view of a semiconductor package structure700 in accordance with some embodiments of the disclosure. It should benoted that the semiconductor package structure 700 may include the sameor similar components as that of the semiconductor package structure 600shown in FIG. 6, and for the sake of simplicity, those components willnot be discussed in detail again. In the following embodiments, thestacking structure includes a plurality of semiconductor components 142,144, 146 below the first semiconductor die 106 and adjacent to thesecond semiconductor die 112.

The semiconductor components 142, 144, 146 may be similar to thesemiconductor components 142, 144, 146 in FIG. 6, and will not berepeated. The semiconductor components 142, 144, 146 may be electricallycoupled to the first semiconductor die 106. Each of the semiconductorcomponents 142, 144, 146 may be surrounded and covered by the moldingmaterial 108. It should be noted that the number and the positions ofthe semiconductor components 142, 144, 146, the first semiconductor die106, and the second semiconductor die 112 are illustrative only, and thepresent disclosure is not limit thereto.

For example, the semiconductor components 142, 144, 146 may be stackedvertically. Alternatively, the stacking structure may include twosemiconductor components which are stacked vertically. In some otherembodiments, the stacking structure may include four semiconductorcomponents, wherein two of them are stacked vertically over asemiconductor component, and the other semiconductor component isdisposed over the semiconductor component and adjacent to the twosemiconductor components.

Depending on the routing design of the first package structure 100 a,the semiconductor package structure 700 may further include one or moreredistribution layers (such as the third redistribution layer 110 inFIG. 1), one or more conductive pillars (such as the conductive pillar134 in FIG. 3), and/or one or more through vias in semiconductor dies(such as the through via 136 in FIG. 4).

In summary, by disposing one or more redistribution layers, one or moreconductive pillars, and/or one or more through vias in semiconductordies in a package structure, an individual routing channel for an IPcore in the package structure to another package structure can beachieved. As a result, the routing channels can be optimized separately,and the channel design flexibility can be increased.

While the invention has been described by way of example and in terms ofthe preferred embodiments, it should be understood that the invention isnot limited to the disclosed embodiments. On the contrary, it isintended to cover various modifications and similar arrangements (aswould be apparent to those skilled in the art). Therefore, the scope ofthe appended claims should be accorded the broadest interpretation so asto encompass all such modifications and similar arrangements.

What is claimed is:
 1. A semiconductor package structure, comprising: afrontside redistribution layer; a stacking structure disposed over thefrontside redistribution layer and comprising a first semiconductor dieand a second semiconductor die over the first semiconductor die; abackside redistribution layer disposed over the stacking structure; afirst intellectual property (IP) core disposed in the stacking structureand electrically coupled to the frontside redistribution layer through afirst routing channel; and a second IP core disposed in the stackingstructure and electrically coupled to the backside redistribution layerthrough a second routing channel, wherein the second routing channel isseparated from the first routing channel and electrically insulated fromthe frontside redistribution layer.
 2. The semiconductor packagestructure as claimed in claim 1, further comprising a package structuredisposed over the backside redistribution layer and electrically coupledto the second IP core through the second routing channel.
 3. Thesemiconductor package structure as claimed in claim 1, wherein thesecond routing channel comprises: a conductive pillar adjacent to thestacking structure and electrically coupled to the backsideredistribution layer; and a redistribution layer between a top surfaceof the first semiconductor die and a bottom surface of the secondsemiconductor die and electrically coupled to the conductive pillar. 4.The semiconductor package structure as claimed in claim 3, wherein thesecond routing channel further comprises a plurality of through vias inthe first semiconductor die.
 5. The semiconductor package structure asclaimed in claim 3, further comprising a molding material that surroundsthe conductive pillar and the stacking structure, wherein a sidewall ofthe molding material is coplanar with a sidewall of the thirdredistribution layer.
 6. The semiconductor package structure as claimedin claim 1, wherein the second routing channel comprises a conductivepillar disposed over the first semiconductor die and adjacent to thesecond semiconductor die.
 7. The semiconductor package structure asclaimed in claim 6, further comprising a molding material that surroundsthe conductive pillar and the second semiconductor die, wherein thesidewall of the molding material is coplanar with a sidewall of thefirst semiconductor die.
 8. The semiconductor package structure asclaimed in claim 6, wherein the second routing channel further comprisesa through via in the first semiconductor die.
 9. The semiconductorpackage structure as claimed in claim 1, wherein the second routingchannel comprises a first through via in the second semiconductor die.10. The semiconductor package structure as claimed in claim 9, whereinthe second routing channel further comprises a second through via in thefirst semiconductor die.
 11. The semiconductor package structure asclaimed in claim 1, further comprising a conductive pillar disposedbelow the second semiconductor die and adjacent to the firstsemiconductor die, wherein the conductive pillar electrically couplesthe second semiconductor die to the frontside redistribution layer. 12.The semiconductor package structure as claimed in claim 11, furthercomprising a molding material that surrounds the conductive pillar andthe first semiconductor die, wherein the sidewall of the moldingmaterial is coplanar with a sidewall of the second semiconductor die.13. The semiconductor package structure as claimed in claim 1, whereinthe second routing channel passes a region shielded by the firstsemiconductor die and/or the second semiconductor die.
 14. Asemiconductor routing structure, comprising: a first package structurehaving a frontside and a backside and comprising a stacking structurehaving a first intellectual property (IP) core and a second IP core; afirst routing channel electrically coupling the first IP core to a firstredistribution layer on the frontside of the first package structure;and a second routing channel independently and electrically coupling thesecond IP core to a second redistribution layer on the backside of thefirst package structure, wherein the second routing channel is separatedfrom the first routing channel and electrically insulated from the firstredistribution layer.
 15. The semiconductor routing structure as claimedin claim 14, further comprising a second package structure disposed onthe second redistribution layer, wherein the second package structurereceives a control signal from the second IP core through the secondrouting channel.
 16. The semiconductor routing structure as claimed inclaim 14, wherein the stacking structure comprises a first semiconductordie and a second semiconductor die stacked vertically, and the first IPcore and the second IP core are each independently disposed in the firstsemiconductor die or the second semiconductor die.
 17. The semiconductorrouting structure as claimed in claim 16, wherein the second routingchannel comprises a through via in the first semiconductor die andelectrically couples the second semiconductor die to the secondredistribution layer.
 18. The semiconductor routing structure as claimedin claim 16, wherein the second routing channel comprises a conductivepillar adjacent to the first semiconductor die and electrically couplesthe second semiconductor die to the second redistribution layer.
 19. Thesemiconductor routing structure as claimed in claim 16, wherein thesecond routing channel comprises a third redistribution layer extendingbetween the first semiconductor die and the second semiconductor die.20. The semiconductor routing structure as claimed in claim 19, whereinthe second routing channel comprises a conductive pillar adjacent to thestacking structure and electrically coupled to the second redistributionlayer and the third distribution layer.